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Fully Automated Optical Detection Using Deep Algorithms for Rapid Defect Classification
InStock Source-listed auditby Suzhou Bozhon Semiconductor Co., Ltd
₹83,50,000≈ $100,000 · indicative, confirm with supplier
Supplier information
Description
Fully Automated Optical Detection Using Deep Algorithms for Rapid Defect Classification, Find Details and Price about Die Bonder Die Bonding from Fully Automated Optical Detection Using Deep Algorithms for Rapid Defect Classification - Suzhou Bozhon Semiconductor Co., Ltd
Specifications
TypeHigh-speed Chip Mounter
SpeedHigh Speed
Nozzle12 Nozzles Per Head, with Dynamic Tool Change
OriginChina
Weights2200kg
Warranty12 Months
ConditionNew
Model NO.IR9822
PrecisionHigh Precision
TrademarkSuzhou Bozhon Semiconductor Co
CertificationISO, CE
Specification1900mm*1100mm*1800mm
