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Ky8030-3 3D Solder Paste Inspection Spi System with Dual Projection Technology for SMT Assembly. Full Board Inspection: Scans 100% of PCB including pad, component edges, and corners for complete process verification. SPC Software Included: Built-in SPC (Statistical Process Control) provides real-time trend charts and defect reports. Automatic 2D/3D Measurement: Supports both 2D imaging and 3D measurement modes for flexible inspection strategy.