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Diamond Cutting Blade for Wafering and Dicing
InStock Source-listed auditby Zhengzhou Research Institute for Abrasives & Grinding
₹6,680≈ $80 · indicative, confirm with supplier
Supplier information
Grinding Wheel Manufacturer, Diamond Grinding Wheels, Diamond Tools Supplier - Zhengzhou Research Institute for Abrasives & Grinding
Manufacturer/Factory, Trading Company
Audited supplier
Description
Diamond Cutting Blade for Wafering and Dicing, Find Details and Price about Resin Bond Diamond Cutting Blade Resin Bond Diamond Dicing Blade from Diamond Cutting Blade for Wafering and Dicing - Zhengzhou Research Institute for Abrasives & Grinding
Specifications
KindDiamond Wheel
UsageStone Cutting, Plastics, Laminate Plate, Semiconductor Cutting, Lab Use Super-thin Saw Blade, Optical Glass Cutting, Fire-Retardant, Porcelain, Drilling, Arts Cutting, Engineering Material
Model NO.1A1, 1A8, 1A1W, 1A1R
Manufacturing ArtsSinter
Saw Blade External Diameter150mm
