Power Electronics Ceramic Substrate with Amb Dbc Direct Bonded Copper Featuring High Thermal Conductivity Metallized Layer

Name: Power Electronics Ceramic Substrate with Amb Dbc Direct Bonded Copper Featuring High Thermal Conductivity Metallized Layer
Brand: construction hoist Manufacturer, tower crane, Construction Hoist Supplier - Shenyang Vhandy Technology Co., Ltd
SKU: RTOrbKCkrlYj
Price: 84 INR

InStock Source-listed auditby Shenyang Vhandy Technology Co., Ltd

₹84≈ $1 · indicative, confirm with supplier

Chat now

Supplier information

construction hoist Manufacturer, tower crane, Construction Hoist Supplier - Shenyang Vhandy Technology Co., Ltd

Trading Company

Description

Power Electronics Ceramic Substrate with Amb Dbc Direct Bonded Copper Featuring High Thermal Conductivity Metallized Layer, Find Details and Price about Power Ceramic Substrate and Amb Ceramic Substrate from Shenyang Vhandy Technology Co., Ltd.