Loading…
High-Frequency Thermal Pad Interface Material Customized Die-Cuting Low Thermal Resistance
4.0InStock Source-listed auditby GUANGDONG DONGSEN ZHICHUANG TECHNOLOGY CO., LTD.
₹8≈ $0.1 · indicative, confirm with supplier
Description
High-Frequency Thermal Pad Interface Material Customized Die-Cuting Low Thermal Resistance, Find Details and Price about Thermal Pad Thermal Silicone Pad from High-Frequency Thermal Pad Interface Material Customized Die-Cuting Low Thermal Resistance - GUANGDONG DONGSEN ZHICHUANG TECHNOLOGY CO., LTD.
Specifications
OriginChina
Density1.8-5g/Cc
HS Code35069900
Hardness10-70 Shore C
MaterialSilicone
Model NO.TSP
Thickness0.3-14.0mm
TrademarkTOUSEN
Package Size10.00cm * 10.00cm * 10.00cm
Specification200*400/330*300/custom
Thermal Rating94 V0
Maximum Voltage<10KV
