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High Precision 3D Optical Testing Equipment for Semiconductor Chip Packaging
InStock Source-listed auditby Suzhou Bozhon Semiconductor Co., Ltd
₹83,50,000≈ $100,000 · indicative, confirm with supplier
Supplier information
Audited supplier
Description
High Precision 3D Optical Testing Equipment for Semiconductor Chip Packaging, Find Details and Price about Aoi Inspection from High Precision 3D Optical Testing Equipment for Semiconductor Chip Packaging - Suzhou Bozhon Semiconductor Co., Ltd
Specifications
OcrAvaliable
Uph2500 (Pkg35X35 BGA) 11K (Pkg5*5 Qfn 5s) 21K (Pkg5*
OriginChina
Model NO.IR9822
TrademarkSuzhou Bozhon Semiconductor Co
Min Defect30um
ApplicationHealth & Medicine
Specification2000*1650*1400
2D Code ReadingAvaliable
Input&Output MediaTray to Tray
After-sales Service7*24 Hour After-Sales Service
Dent/Bulge Inspection
